Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity

Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity

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Bibliographic Details
Main Authors:	Mohd Azli, Salim, Ameeruz Kamal, Ab Wahid, Nor Azmmi, Masripan, Chonlatee, Photong, Adzni, Md. Saad, Mohd Zaid, Akop, Muhd Ridzuan, Mansor
Other Authors:	azli@utem.edu.my
Format:	Article
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2022
Subjects:	GNP/Ag Hybrid Die-attach materials Steady-state thermal Thermal resistance Total heat flux
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072
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Institution:	Universiti Malaysia Perlis
Language:	English

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Summary:	Link to publisher's homepage at http://ijneam.unimap.edu.my