Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity

Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity

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Bibliographic Details
Main Authors: Mohd Azli, Salim, Ameeruz Kamal, Ab Wahid, Nor Azmmi, Masripan, Chonlatee, Photong, Adzni, Md. Saad, Mohd Zaid, Akop, Muhd Ridzuan, Mansor
Other Authors: azli@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
Subjects:
GNP/Ag Hybrid
Die-attach materials
Steady-state thermal
Thermal resistance
Total heat flux
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072

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