Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
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2022
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my.unimap-760722022-08-24T02:22:35Z Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity Mohd Azli, Salim Ameeruz Kamal, Ab Wahid Mohd Azli, Salim Nor Azmmi, Masripan Chonlatee, Photong Adzni, Md. Saad Mohd Zaid, Akop Muhd Ridzuan, Mansor azli@utem.edu.my Jabatan Kejuruteraan Mekanikal, Politeknik Sultan Azlan Shah Fakulti Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka (UTeM) Advanced Manufacturing Centre, Universiti Teknikal Malaysia Melaka (UTeM) Graduate School, Mahasarakham University GNP/Ag Hybrid Die-attach materials Steady-state thermal Thermal resistance Total heat flux Link to publisher's homepage at http://ijneam.unimap.edu.my The thermal conductivities of a multilayer model of GNP/Ag hybrid die-attach material are explored using steady-state thermal modeling. The heat flux in multilayer GNP/Ag hybrid structures is shown to be highly layer number dependent. It rises when thermal conductivity increases while density and specific heat value remain constant. For FEA analysis, six different thermal conductivity of GNP/Ag hybrid die-attach materials models were developed to compare with baseline findings from another researcher. By evaluating the total heat flux, FEA modeling was utilized to identify how the increase of thermal conductivity had affected the die-attach materials model. Fourier’s law of heat conduction was implemented to investigate thermal characteristics during heating with commercial software code, namely ANSYS. Temperature dependency and thermal material properties, and other thermal parameters boundary conditions were taken into consideration throughout the thermal conductivity procedure. The total heat flux distribution changes of dies with die-attach and substrate assemblies were obtained and thermal characteristics were analyzed during heating within 1 second by using temperature load, 90.3 ° C on the dies (diode) surface. Moreover, heat flow and material resistance were also manually calculated in the model by comparing the relationship discovered in the die-attach materials. GNP/Ag hybrid with the highest thermal conductivity, 300 W/m.K, offered the highest heat flux value in terms of simulation, 7.081 x 106 W/m2, and calculated, 24.695 x 106 W/m2. As a result, material resistance and heat flux were inversely proportional, and as material resistance reduced, so did heat flux or heat conduction on the material. Thermal conductivity values discovered on die-attach materials can also be utilized to demonstrate the similarities between thermal and material resistance. 2022-08-24T02:22:35Z 2022-08-24T02:22:35Z 2022-03 Article International Journal of Nanoelectronics and Materials, vol.15 (Special Issue), 2022, pages 381-391 1985-5761 (Printed) 2232-1535 (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072 http://ijneam.unimap.edu.my en Special Issue ISSTE 2022; Universiti Malaysia Perlis (UniMAP) |
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GNP/Ag Hybrid Die-attach materials Steady-state thermal Thermal resistance Total heat flux |
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GNP/Ag Hybrid Die-attach materials Steady-state thermal Thermal resistance Total heat flux Mohd Azli, Salim Ameeruz Kamal, Ab Wahid Mohd Azli, Salim Nor Azmmi, Masripan Chonlatee, Photong Adzni, Md. Saad Mohd Zaid, Akop Muhd Ridzuan, Mansor Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity |
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Link to publisher's homepage at http://ijneam.unimap.edu.my |
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azli@utem.edu.my |
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azli@utem.edu.my Mohd Azli, Salim Ameeruz Kamal, Ab Wahid Mohd Azli, Salim Nor Azmmi, Masripan Chonlatee, Photong Adzni, Md. Saad Mohd Zaid, Akop Muhd Ridzuan, Mansor |
| format |
Article |
| author |
Mohd Azli, Salim Ameeruz Kamal, Ab Wahid Mohd Azli, Salim Nor Azmmi, Masripan Chonlatee, Photong Adzni, Md. Saad Mohd Zaid, Akop Muhd Ridzuan, Mansor |
| author_sort |
Mohd Azli, Salim |
| title |
Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity |
| title_short |
Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity |
| title_full |
Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity |
| title_fullStr |
Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity |
| title_full_unstemmed |
Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity |
| title_sort |
numerical analysis of gnp/ag die-attach adhesives with different thermal conductivity |
| publisher |
Universiti Malaysia Perlis (UniMAP) |
| publishDate |
2022 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072 |
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1751537870855733248 |