Process optimization approach in fine pitch Cu wire bonding

With SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, w...

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Main Authors:	Wong B.K., Yong C.C., Eu P.L., Yap B.K.
Other Authors:	36992192300
Format:	Conference paper
Published:	2023
Subjects:	Design of experiments Dielectric materials Optimization Silicon compounds Spheres Thermal aging Thermoelectric equipment Wafer bonding Aluminum pad Ball diameter Ball shear Ball-shear test Bond pad Bonding parameters Bonding quality Critical factors Critical response Fine pitch Wafer technology Wire bonding Wire
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Institution:	Universiti Tenaga Nasional

id	my.uniten.dspace-30475
record_format	dspace
spelling	my.uniten.dspace-304752023-12-29T15:48:17Z Process optimization approach in fine pitch Cu wire bonding Wong B.K. Yong C.C. Eu P.L. Yap B.K. 36992192300 24726352800 55911544700 26649255900 Design of experiments Dielectric materials Optimization Silicon compounds Spheres Thermal aging Thermoelectric equipment Wafer bonding Aluminum pad Ball diameter Ball shear Ball-shear test Bond pad Bonding parameters Bonding quality Critical factors Critical response Fine pitch Wafer technology Wire bonding Wire With SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, wire pull, ball shear and number of metal lift/peeling and ball lift after wire pull) are affecting bonding quality. Design of experiment and response of surface were used to optimize the bonding parameters. The wire pull and ball shear test at three thermal aging read points were studied. � 2011 IEEE. Final 2023-12-29T07:48:17Z 2023-12-29T07:48:17Z 2011 Conference paper 10.1109/ICEDSA.2011.5959077 2-s2.0-80055092447 https://www.scopus.com/inward/record.uri?eid=2-s2.0-80055092447&doi=10.1109%2fICEDSA.2011.5959077&partnerID=40&md5=b5475216c175b77de9b5449fc14838a6 https://irepository.uniten.edu.my/handle/123456789/30475 5959077 147 151 Scopus
institution	Universiti Tenaga Nasional
building	UNITEN Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Tenaga Nasional
content_source	UNITEN Institutional Repository
url_provider	http://dspace.uniten.edu.my/
topic	Design of experiments Dielectric materials Optimization Silicon compounds Spheres Thermal aging Thermoelectric equipment Wafer bonding Aluminum pad Ball diameter Ball shear Ball-shear test Bond pad Bonding parameters Bonding quality Critical factors Critical response Fine pitch Wafer technology Wire bonding Wire
spellingShingle	Design of experiments Dielectric materials Optimization Silicon compounds Spheres Thermal aging Thermoelectric equipment Wafer bonding Aluminum pad Ball diameter Ball shear Ball-shear test Bond pad Bonding parameters Bonding quality Critical factors Critical response Fine pitch Wafer technology Wire bonding Wire Wong B.K. Yong C.C. Eu P.L. Yap B.K. Process optimization approach in fine pitch Cu wire bonding
description	With SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, wire pull, ball shear and number of metal lift/peeling and ball lift after wire pull) are affecting bonding quality. Design of experiment and response of surface were used to optimize the bonding parameters. The wire pull and ball shear test at three thermal aging read points were studied. � 2011 IEEE.
author2	36992192300
author_facet	36992192300 Wong B.K. Yong C.C. Eu P.L. Yap B.K.
format	Conference paper
author	Wong B.K. Yong C.C. Eu P.L. Yap B.K.
author_sort	Wong B.K.
title	Process optimization approach in fine pitch Cu wire bonding
title_short	Process optimization approach in fine pitch Cu wire bonding
title_full	Process optimization approach in fine pitch Cu wire bonding
title_fullStr	Process optimization approach in fine pitch Cu wire bonding
title_full_unstemmed	Process optimization approach in fine pitch Cu wire bonding
title_sort	process optimization approach in fine pitch cu wire bonding
publishDate	2023
_version_	1806427529041412096

Process optimization approach in fine pitch Cu wire bonding

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