A study on inter-metallic compound formation and structure of lead free SnAgCu solder system
This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting...
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| Main Authors: | , , , , , |
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| Format: | |
| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5315 |
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| Institution: | Universiti Tenaga Nasional |