A study on inter-metallic compound formation and structure of lead free SnAgCu solder system
This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting...
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my.uniten.dspace-53152017-11-15T02:57:29Z A study on inter-metallic compound formation and structure of lead free SnAgCu solder system Ahmad, I. Jiun, H.H. Leng, E.P. Majlis, B.Y. Jalar, A. Wagiran, R. This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that 1wt%Ag 0.5wt%Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results. © 2006 IEEE. 2017-11-15T02:57:29Z 2017-11-15T02:57:29Z 2006 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5315 |
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This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that 1wt%Ag 0.5wt%Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results. © 2006 IEEE. |
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| author |
Ahmad, I. Jiun, H.H. Leng, E.P. Majlis, B.Y. Jalar, A. Wagiran, R. |
| spellingShingle |
Ahmad, I. Jiun, H.H. Leng, E.P. Majlis, B.Y. Jalar, A. Wagiran, R. A study on inter-metallic compound formation and structure of lead free SnAgCu solder system |
| author_facet |
Ahmad, I. Jiun, H.H. Leng, E.P. Majlis, B.Y. Jalar, A. Wagiran, R. |
| author_sort |
Ahmad, I. |
| title |
A study on inter-metallic compound formation and structure of lead free SnAgCu solder system |
| title_short |
A study on inter-metallic compound formation and structure of lead free SnAgCu solder system |
| title_full |
A study on inter-metallic compound formation and structure of lead free SnAgCu solder system |
| title_fullStr |
A study on inter-metallic compound formation and structure of lead free SnAgCu solder system |
| title_full_unstemmed |
A study on inter-metallic compound formation and structure of lead free SnAgCu solder system |
| title_sort |
study on inter-metallic compound formation and structure of lead free snagcu solder system |
| publishDate |
2017 |
| url |
http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5315 |
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1644493655112679424 |