Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings

Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings

In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...

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Bibliographic Details
Main Authors: Hamzah, Khairum, Waini, Iskandar, Mohd Nordin, Muhammad Haziq Iqmal, Nik Long, Nik Mohd Asri, Khashi’ie, Najiyah Safwa, Zainal, Nurul Amira, Sayed Nordin, Sayed Kushairi
Format: Article
Language:English
Published: Semarak Ilmu Publishing 2023
Online Access:http://eprints.utem.edu.my/id/eprint/27244/2/0215325012024132323694.PDF
http://eprints.utem.edu.my/id/eprint/27244/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4374/3418
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Institution: Universiti Teknikal Malaysia Melaka
Language: English

Internet

http://eprints.utem.edu.my/id/eprint/27244/2/0215325012024132323694.PDF
http://eprints.utem.edu.my/id/eprint/27244/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4374/3418

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