Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings

• Main Authors: Hamzah, Khairum, Waini, Iskandar, Mohd Nordin, Muhammad Haziq Iqmal, Nik Long, Nik Mohd Asri, Khashi’ie, Najiyah Safwa, Zainal, Nurul Amira, Sayed Nordin, Sayed Kushairi
• Format: Article
• Language: English
• Published: Semarak Ilmu Publishing 2023
• Online Access: http://eprints.utem.edu.my/id/eprint/27244/2/0215325012024132323694.PDF; http://eprints.utem.edu.my/id/eprint/27244/; https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4374/3418
• Institution: Universiti Teknikal Malaysia Melaka

In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...