Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings
In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...
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2023
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my.utem.eprints.272442024-07-01T09:50:10Z http://eprints.utem.edu.my/id/eprint/27244/ Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) function method is used to formulate this crack phenomenon into the hypersingular integral equations (HSIEs) with the help of the continuity conditions of the resultant electric force and displacement electric function. The normal and tangential traction along the crack segment serves as the right-hand side of the integral equation. The HSIEs are solved numerically for the unknown crack opening displacement (COD) function, electric current density, and energy flux load using the appropriate quadrature formulas. The numerical solution presented the behavior of the dimensionless stress intensity factors (SIFs) at the crack tips which depend on the elastic constant’s ratio, the position of the crack, the electric conductivity, and the thermal expansion coefficients. Semarak Ilmu Publishing 2023 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/27244/2/0215325012024132323694.PDF Hamzah, Khairum and Waini, Iskandar and Mohd Nordin, Muhammad Haziq Iqmal and Nik Long, Nik Mohd Asri and Khashi’ie, Najiyah Safwa and Zainal, Nurul Amira and Sayed Nordin, Sayed Kushairi (2023) Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings. Journal of Advanced Research in Applied Mechanics, 113 (1). pp. 27-36. ISSN 2289-7895 https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4374/3418 10.37934/aram.113.1.2736 |
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In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) function method is used to formulate this crack phenomenon into the hypersingular integral equations (HSIEs) with the help of the continuity conditions of the resultant electric force and displacement electric function. The normal and tangential traction along the crack segment serves as the right-hand side of the integral equation. The HSIEs are solved numerically for the unknown crack opening displacement (COD) function, electric current density, and energy flux load using the appropriate quadrature formulas. The numerical solution presented the behavior of the dimensionless stress intensity factors (SIFs) at the crack tips which depend on the elastic constant’s ratio, the position of the crack, the electric conductivity, and the thermal expansion coefficients. |
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Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi |
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Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
author_facet |
Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi |
author_sort |
Hamzah, Khairum |
title |
Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
title_short |
Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
title_full |
Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
title_fullStr |
Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
title_full_unstemmed |
Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
title_sort |
numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
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Semarak Ilmu Publishing |
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2023 |
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http://eprints.utem.edu.my/id/eprint/27244/2/0215325012024132323694.PDF http://eprints.utem.edu.my/id/eprint/27244/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4374/3418 |
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