Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method

• Main Authors: Kok, Chee Kuang, J.W.C. Chin, M.M. Rajmohan, V.S.H. Yeo, Said, Md Radzai
• Format: Article
• Language: English
• Published: springer 2012
• Online Access: http://eprints.utem.edu.my/id/eprint/4147/1/ck.kok-10.1007_s11664-012-1918-8.pdf; http://eprints.utem.edu.my/id/eprint/4147/; https://link.springer.com/article/10.1007/s11664-012-1918-8
• Institution: Universiti Teknikal Malaysia Melaka

The lead trim-and-form process is important in the manufacturing of programmable logic devices, microprocessors, and memories. Normally, inspection of a chip package is performed in a lead inspection machine after the lead forming process to detect defects on the leads. One such defect is the lead i...