Nanopackaging : nanotechnologies and electronics packaging
This book is a compendium of in depth reviews written by some of the leading practitioners in the field. They cover the broad aspects of the field from materials preparations, materials properties, surface modifications, engineering applications, mathematical simulations, and “More than Moore” techn...
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| Format: | Book |
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| Published: |
Springer
2017
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| Subjects: | |
| Online Access: | http://repository.vnu.edu.vn/handle/VNU_123/29977 |
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| Institution: | Vietnam National University, Hanoi |
| Summary: | This book is a compendium of in depth reviews written by some of the leading practitioners in the field. They cover the broad aspects of the field from materials preparations, materials properties, surface modifications, engineering applications, mathematical simulations, and “More than Moore” technical issues. It is a timely and important contribution to the technical literature for practitioners and research-ers in the electronic industry field. |
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