Challenges of folded flex substrates: Fold blister resolution on stacked packages
A flash memory chip has been stacked on a processor chip to meet the requirements of high speed mobile applications processing. This required the use of flex cable as a substrate. Solder joints between chips are formed in a reflow process at
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| Format: | text |
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Animo Repository
2004
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| Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/13348 |
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| Institution: | De La Salle University |