The selection of die backside metallization for solder
In support of the need to achieve processor speeds above 2.5 GHz, the feasibility of metallurgical heat transfer between chip and heat sink is under study. The selection of a suitable metallization on the chip backside was undertaken. Candidate stackss were evaluated based on reliability and thermal...
Saved in:
| Main Authors: | , |
|---|---|
| 格式: | text |
| 出版: |
Animo Repository
2001
|
| 主題: | |
| 在線閱讀: | https://animorepository.dlsu.edu.ph/faculty_research/13346 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | De La Salle University |