The selection of die backside metallization for solder

• المؤلفون الرئيسيون: Tirol, D.J. Rean D., Agraharam, Sairam
• التنسيق: text
• منشور في: Animo Repository 2001
• الموضوعات: Metallizing; Engineering Physics; Physical Sciences and Mathematics; Physics
• الوصول للمادة أونلاين: https://animorepository.dlsu.edu.ph/faculty_research/13346
• المؤسسة: De La Salle University

In support of the need to achieve processor speeds above 2.5 GHz, the feasibility of metallurgical heat transfer between chip and heat sink is under study. The selection of a suitable metallization on the chip backside was undertaken. Candidate stackss were evaluated based on reliability and thermal...