Challenges of folded flex substrates: Fold blister resolution on stacked packages

A flash memory chip has been stacked on a processor chip to meet the requirements of high speed mobile applications processing. This required the use of flex cable as a substrate. Solder joints between chips are formed in a reflow process at

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Bibliographic Details
Main Author:	Tirol, D.J. Rean D.
Format:	text
Published:	Animo Repository 2004
Subjects:	Blister packs Flexible packaging Engineering Physics Physical Sciences and Mathematics Physics
Online Access:	https://animorepository.dlsu.edu.ph/faculty_research/13348
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	De La Salle University

id	oai:animorepository.dlsu.edu.ph:faculty_research-13821
record_format	eprints
spelling	oai:animorepository.dlsu.edu.ph:faculty_research-138212024-11-11T00:49:59Z Challenges of folded flex substrates: Fold blister resolution on stacked packages Tirol, D.J. Rean D. A flash memory chip has been stacked on a processor chip to meet the requirements of high speed mobile applications processing. This required the use of flex cable as a substrate. Solder joints between chips are formed in a reflow process at 2004-01-01T08:00:00Z text https://animorepository.dlsu.edu.ph/faculty_research/13348 Faculty Research Work Animo Repository Blister packs Flexible packaging Engineering Physics Physical Sciences and Mathematics Physics
institution	De La Salle University
building	De La Salle University Library
continent	Asia
country	Philippines Philippines
content_provider	De La Salle University Library
collection	DLSU Institutional Repository
topic	Blister packs Flexible packaging Engineering Physics Physical Sciences and Mathematics Physics
spellingShingle	Blister packs Flexible packaging Engineering Physics Physical Sciences and Mathematics Physics Tirol, D.J. Rean D. Challenges of folded flex substrates: Fold blister resolution on stacked packages
description	A flash memory chip has been stacked on a processor chip to meet the requirements of high speed mobile applications processing. This required the use of flex cable as a substrate. Solder joints between chips are formed in a reflow process at
format	text
author	Tirol, D.J. Rean D.
author_facet	Tirol, D.J. Rean D.
author_sort	Tirol, D.J. Rean D.
title	Challenges of folded flex substrates: Fold blister resolution on stacked packages
title_short	Challenges of folded flex substrates: Fold blister resolution on stacked packages
title_full	Challenges of folded flex substrates: Fold blister resolution on stacked packages
title_fullStr	Challenges of folded flex substrates: Fold blister resolution on stacked packages
title_full_unstemmed	Challenges of folded flex substrates: Fold blister resolution on stacked packages
title_sort	challenges of folded flex substrates: fold blister resolution on stacked packages
publisher	Animo Repository
publishDate	2004
url	https://animorepository.dlsu.edu.ph/faculty_research/13348
_version_	1816861341056499712

Challenges of folded flex substrates: Fold blister resolution on stacked packages

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