Layered polymeric composite spacer for stacked chip scale packages

Layered polymeric composite spacer for stacked chip scale packages

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Bibliographic Details
Main Authors: Camacho, Drexel H., Tamayo, Myra
Format: text
Published: Animo Repository 2005
Subjects:
Chip scale packaging
Manufacturing
Online Access:https://animorepository.dlsu.edu.ph/faculty_research/5712
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Institution: De La Salle University
id oai:animorepository.dlsu.edu.ph:faculty_research-6455
record_format eprints
spelling oai:animorepository.dlsu.edu.ph:faculty_research-64552022-05-05T03:40:55Z Layered polymeric composite spacer for stacked chip scale packages Camacho, Drexel H. Tamayo, Myra 2005-11-26T08:00:00Z text https://animorepository.dlsu.edu.ph/faculty_research/5712 Faculty Research Work Animo Repository Chip scale packaging Manufacturing
institution De La Salle University
building De La Salle University Library
continent Asia
country Philippines
Philippines
content_provider De La Salle University Library
collection DLSU Institutional Repository
topic Chip scale packaging
Manufacturing
spellingShingle Chip scale packaging
Manufacturing
Camacho, Drexel H.
Tamayo, Myra
Layered polymeric composite spacer for stacked chip scale packages
format text
author Camacho, Drexel H.
Tamayo, Myra
author_facet Camacho, Drexel H.
Tamayo, Myra
author_sort Camacho, Drexel H.
title Layered polymeric composite spacer for stacked chip scale packages
title_short Layered polymeric composite spacer for stacked chip scale packages
title_full Layered polymeric composite spacer for stacked chip scale packages
title_fullStr Layered polymeric composite spacer for stacked chip scale packages
title_full_unstemmed Layered polymeric composite spacer for stacked chip scale packages
title_sort layered polymeric composite spacer for stacked chip scale packages
publisher Animo Repository
publishDate 2005
url https://animorepository.dlsu.edu.ph/faculty_research/5712
_version_ 1767196359675346944

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