Layered polymeric composite spacer for stacked chip scale packages

Saved in:
Bibliographic Details
Main Authors: Camacho, Drexel H., Tamayo, Myra
Format: text
Published: Animo Repository 2005
Subjects:
Online Access:https://animorepository.dlsu.edu.ph/faculty_research/5712
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: De La Salle University

Similar Items