Surface and elemental characterization of electrodeless plating of nickel and phosphor on copper substrate
In this study, an electrodeless nickel bath uses a phosphor chemical reducing agent to deposit nickel coatings uniformly on a receptive surface such as copper without the use of applied current. The plating reaction depletes the bath of nickel and reducing agent that lowers the bath pH. In order to...
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Main Authors: | , , , , , , , |
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Format: | text |
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Animo Repository
2006
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Subjects: | |
Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/9327 |
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Institution: | De La Salle University |