Surface and elemental characterization of electrodeless plating of nickel and phosphor on copper substrate

Surface and elemental characterization of electrodeless plating of nickel and phosphor on copper substrate

In this study, an electrodeless nickel bath uses a phosphor chemical reducing agent to deposit nickel coatings uniformly on a receptive surface such as copper without the use of applied current. The plating reaction depletes the bath of nickel and reducing agent that lowers the bath pH. In order to...

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Bibliographic Details
Main Authors: Santos, Gil Nonato C., Otake, K., Ngo, V., De Los Reyes, Ronald, Ong, Prane Mariel B., Quiroga, Reuben V., Maniquis, R., Amorsolo, A.
Format: text
Published: Animo Repository 2006
Subjects:
Plating baths
Plating
Physics
Online Access:https://animorepository.dlsu.edu.ph/faculty_research/9327
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Institution: De La Salle University
Description
Summary:In this study, an electrodeless nickel bath uses a phosphor chemical reducing agent to deposit nickel coatings uniformly on a receptive surface such as copper without the use of applied current. The plating reaction depletes the bath of nickel and reducing agent that lowers the bath pH. In order to keep the bath components within the appropriate ranges, analysis of bath concentration with respect to time was performed for 20, 40, and 60 minutes. The JEOL 5300 Series Scanning Electron Microscope and Oxfords Energy Dispersive X-ray System was used to examine the surface and elemental characteristics of the plating.

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