Surface and elemental characterization of electrodeless plating of nickel and phosphor on copper substrate

• Main Authors: Santos, Gil Nonato C., Otake, K., Ngo, V., De Los Reyes, Ronald, Ong, Prane Mariel B., Quiroga, Reuben V., Maniquis, R., Amorsolo, A.
• Format: text
• Published: Animo Repository 2006
• Subjects: Plating baths; Plating; Physics
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/9327
• Institution: De La Salle University

In this study, an electrodeless nickel bath uses a phosphor chemical reducing agent to deposit nickel coatings uniformly on a receptive surface such as copper without the use of applied current. The plating reaction depletes the bath of nickel and reducing agent that lowers the bath pH. In order to...