Influence of substrate heating on hole geometry and spatter area in femtosecond laser drilling of silicon

• المؤلفون الرئيسيون: Jiao, Lishi, Moon, Seung Ki, Ng, E. Y. K., Zheng, H. Y., Son, H. S.
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Mechanical engineering::Kinematics and dynamics of machinery
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/100052; http://hdl.handle.net/10220/19579
• المؤسسة: Nanyang Technological University

The objective of this research is to evaluate the effects of the hole geometry and the spatter area around the drilled hole by femtosecond laser deep drilling on silicon with various temperatures. Deep through holes were produced on single crystal silicon wafer femtosecond laser at elevated temperat...