Cyber-physical management for heterogeneously integrated 3D thousand-core on-chip microprocessor

• Main Authors: P. D., Sai Manoj, Yu, Hao
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Computer hardware, software and systems
• Online Access: https://hdl.handle.net/10356/100925; http://hdl.handle.net/10220/18210
• Institution: Nanyang Technological University

Though 3D TSV/TSI technology provides the promising platform for heterogeneous system integration with design drivers ranged from thousand-core microprocessor to millimeter-cubic sensor, the fundamental challenge is lack of light to deal with significantly increased design complexity. From device le...