Microscale heat transfer in macro geometries

• Main Authors: Kong, Kian Shing, Ooi, Kim Tiow
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/104994; http://hdl.handle.net/10220/16782; http://dx.doi.org/10.1109/ITHERM.2012.6231492
• Institution: Nanyang Technological University

The escalating heat dissipation problem in electronic devices has become the key driver to numerous investigations on new cooling techniques, including the heavily-researched microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geome...