A numerical and experimental investigation on microscale heat transfer effect in the combined entry region in macro geometries

The rising heat dissipation problem in electronic devices has led to numerous investigations on microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geometries, which is believed largely due to the fabrication and operational challen...

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Bibliographic Details
Main Authors: Kong, Kian Shing, Ooi, Kim Tiow
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/106621
http://hdl.handle.net/10220/17338
http://dx.doi.org/10.1016/j.ijthermalsci.2013.01.010
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Institution: Nanyang Technological University
Language: English