A numerical and experimental investigation on microscale heat transfer effect in the combined entry region in macro geometries

• المؤلفون الرئيسيون: Kong, Kian Shing, Ooi, Kim Tiow
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Mechanical engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/106621; http://hdl.handle.net/10220/17338; http://dx.doi.org/10.1016/j.ijthermalsci.2013.01.010
• المؤسسة: Nanyang Technological University

The rising heat dissipation problem in electronic devices has led to numerous investigations on microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geometries, which is believed largely due to the fabrication and operational challen...