A numerical and experimental investigation on microscale heat transfer effect in the combined entry region in macro geometries
The rising heat dissipation problem in electronic devices has led to numerous investigations on microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geometries, which is believed largely due to the fabrication and operational challen...
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| Main Authors: | , |
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| 格式: | Article |
| 語言: | English |
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2013
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| 在線閱讀: | https://hdl.handle.net/10356/106621 http://hdl.handle.net/10220/17338 http://dx.doi.org/10.1016/j.ijthermalsci.2013.01.010 |
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