Microscale heat transfer in macro geometries
The escalating heat dissipation problem in electronic devices has become the key driver to numerous investigations on new cooling techniques, including the heavily-researched microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geome...
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| Main Authors: | , |
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| 其他作者: | |
| 格式: | Conference or Workshop Item |
| 語言: | English |
| 出版: |
2013
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| 在線閱讀: | https://hdl.handle.net/10356/104994 http://hdl.handle.net/10220/16782 http://dx.doi.org/10.1109/ITHERM.2012.6231492 |
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| 機構: | Nanyang Technological University |
| 語言: | English |