High frequency electrical properties of copper interconnects patterned by resolution enhanced lithography

• Main Author: Rakesh Kumar
• Other Authors: N. Balasubramanian
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: https://hdl.handle.net/10356/13115
• Institution: Nanyang Technological University

Signal integrity problems associated with on-chip interconnects have become very significant with increase in device integration and circuit frequency. Copper and low-κ dielectric materials are used to improve electrical performance of interconnects for integrated circuits. At radio and microwave fr...