Chemo-thermo-viscoelastic characterization and material modeling of electronic packaging moulding compound materials

• 主要作者: Neo, Raynard Guan Hock
• 其他作者: Yi Sung
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging; DRNTU::Engineering::Materials::Material testing and characterization
• 在線閱讀: http://hdl.handle.net/10356/13494
• 機構: Nanyang Technological University

Highly filled epoxy moulding compounds are widely used for the encapsulation of microelectronic chips today. As thermo-rheological behaviour of these thermosetting materials is complex, the material characteristics must be determined by experiments and described by mathematical models so that a bett...