Chemo-thermo-viscoelastic characterization and material modeling of electronic packaging moulding compound materials

• Main Author: Neo, Raynard Guan Hock
• Other Authors: Yi Sung
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging; DRNTU::Engineering::Materials::Material testing and characterization
• Online Access: http://hdl.handle.net/10356/13494
• Institution: Nanyang Technological University

Highly filled epoxy moulding compounds are widely used for the encapsulation of microelectronic chips today. As thermo-rheological behaviour of these thermosetting materials is complex, the material characteristics must be determined by experiments and described by mathematical models so that a bett...