Towards automatic optical inspection of soldering defects

• Main Authors: Dai, Wenting, Abdul Mujeeb, Erdt, Marius, Sourin, Alexei
• Other Authors: School of Computer Science and Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2020
• Subjects: Engineering::Computer science and engineering; Automated Manufacturing Systems; Classification Of Solder Joint Defects
• Online Access: https://hdl.handle.net/10356/137973
• Institution: Nanyang Technological University

This paper proposes a method for automatic image-based classification of solder joint defects in the context of Automatic Optical Inspection (AOI) of Printed Circuit Boards (PCBs). Machine learning-based approaches are frequently used for image-based inspection. However, a main challenge is to manually create sufficiently large labeled training databases to allow for high accuracy of defect detection. Creating such large training databases is time-consuming, expensive, and often unfeasible in industrial production settings. In order to address this problem, an active learning framework is proposed which starts with only a small labeled subset of training data. The labeled dataset is then enlarged step-by-step by combining K-means clustering with active user input to provide representative samples for the training of an SVM classifier. Evaluations on two databases with insufficient and shifting solder joints samples have shown that the proposed method achieved high accuracy while requiring only minimal user input. The results also demonstrated that the proposed method outperforms random and representative sampling by ~ 3.2% and ~ 2.7%, respectively, and it outperforms the uncertainty sampling method by ~ 0.5%.