Towards automatic optical inspection of soldering defects

• Main Authors: Dai, Wenting, Abdul Mujeeb, Erdt, Marius, Sourin, Alexei
• Other Authors: School of Computer Science and Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2020
• Subjects: Engineering::Computer science and engineering; Automated Manufacturing Systems; Classification Of Solder Joint Defects
• Online Access: https://hdl.handle.net/10356/137973
• Institution: Nanyang Technological University

This paper proposes a method for automatic image-based classification of solder joint defects in the context of Automatic Optical Inspection (AOI) of Printed Circuit Boards (PCBs). Machine learning-based approaches are frequently used for image-based inspection. However, a main challenge is to manua...