Application of supercritical CO2 for wafer processing steps

• Main Authors: Tse, Man Siu., Tay, Joo Hwa., Wong, Fook Sin.
• Other Authors: School of Electrical and Electronic Engineering
• Format: Research Report
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/14252
• Institution: Nanyang Technological University

Invention disclosures have been submitted to NTU for consideration. 1. Method of Forming Palladium Seeding nanoparticles and Film on Barrier Layer for Copper Metallization in Semiconductor Wafer Manufacturing Abstract A method for the deposition of noble metal nanoparticles or thin film such as t...