A study of wireless inter-chip interconnect

• المؤلف الرئيسي: Chen, Zhiming
• مؤلفون آخرون: Zhang Yue Ping
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio; DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/14559

In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate...