A study of wireless inter-chip interconnect

• Main Author: Chen, Zhiming
• Other Authors: Zhang Yue Ping
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio; DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
• Online Access: https://hdl.handle.net/10356/14559
• Institution: Nanyang Technological University

In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate...