A study of wireless inter-chip interconnect

In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate...

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書目詳細資料
主要作者: Chen, Zhiming
其他作者: Zhang Yue Ping
格式: Theses and Dissertations
語言:English
出版: 2008
主題:
在線閱讀:https://hdl.handle.net/10356/14559
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機構: Nanyang Technological University
語言: English