Thermal reliability of a bilayer of Ni(P)/Cu as a diffusion barrier for Cu/Sn/Cu bonding

Thermal reliability of a bilayer of Ni(P)/Cu as a diffusion barrier for Cu/Sn/Cu bonding

This study examines the effects of barrier layers on the aging behavior of Cu/Sn bonding for three-dimensional (3D) integration. We compare the behavior of different bonding structures [Cu/Sn with no barrier, Ni(P) barrier, and Ni(P)/Cu bilayer barrier] after aging samples at 150 °C for long duratio...

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Bibliographic Details
Main Authors: Lee, Byunghoon, Jeon, Haseok, Gan, Chee Lip, Lee, Hoo-Jeong
Other Authors: School of Materials Science and Engineering
Format: Article
Language:English
Published: 2021
Subjects:
Engineering::Materials
Interfacial Reaction
Shear-strength
Online Access:https://hdl.handle.net/10356/146754
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Institution: Nanyang Technological University
Language: English
Description
Summary:This study examines the effects of barrier layers on the aging behavior of Cu/Sn bonding for three-dimensional (3D) integration. We compare the behavior of different bonding structures [Cu/Sn with no barrier, Ni(P) barrier, and Ni(P)/Cu bilayer barrier] after aging samples at 150 °C for long durations (up to 900 h). While the samples with no barrier allowed extensive Cu diffusion and the formation of Kirkendall voids, the Ni(P) barrier samples broke down as Ni outdiffused into the Sn layer. The bilayer barrier samples demonstrated excellent aging stability with the thin Ni(P)/Cu bilayer effectively suppressing Ni outdiffusion.

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