Thermal reliability of a bilayer of Ni(P)/Cu as a diffusion barrier for Cu/Sn/Cu bonding

• Main Authors: Lee, Byunghoon, Jeon, Haseok, Gan, Chee Lip, Lee, Hoo-Jeong
• Other Authors: School of Materials Science and Engineering
• Format: Article
• Language: English
• Published: 2021
• Subjects: Engineering::Materials; Interfacial Reaction; Shear-strength
• Online Access: https://hdl.handle.net/10356/146754
• Institution: Nanyang Technological University

This study examines the effects of barrier layers on the aging behavior of Cu/Sn bonding for three-dimensional (3D) integration. We compare the behavior of different bonding structures [Cu/Sn with no barrier, Ni(P) barrier, and Ni(P)/Cu bilayer barrier] after aging samples at 150 °C for long duratio...