Effect of liquid-liquid transition on solidification and wettability of Sn-0.7Cu-xBi solder

The electrical resistivity-temperature curve (ρ-T) of Sn-0.7Cu-xBi (wt.%) melts was measured, and anomalous changes were observed on the ρ-T curve at the temperature far above the corresponding liquidus. The results reveal that the melts have experienced a temperature-induced liquid-liquid transitio...

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Bibliographic Details
Main Authors: Li, X. F., Zhao, X. M., Zhang, F., Zu, F. Q., Zhou, Wei
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2021
Subjects:
Online Access:https://hdl.handle.net/10356/146880
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Institution: Nanyang Technological University
Language: English