Effect of liquid-liquid transition on solidification and wettability of Sn-0.7Cu-xBi solder

• Main Authors: Li, X. F., Zhao, X. M., Zhang, F., Zu, F. Q., Zhou, Wei
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2021
• Subjects: Engineering::Materials; Sn-0.7Cu-xBi Solders; Liquid-liquid Transition
• Online Access: https://hdl.handle.net/10356/146880
• Institution: Nanyang Technological University

The electrical resistivity-temperature curve (ρ-T) of Sn-0.7Cu-xBi (wt.%) melts was measured, and anomalous changes were observed on the ρ-T curve at the temperature far above the corresponding liquidus. The results reveal that the melts have experienced a temperature-induced liquid-liquid transitio...