Effect of liquid-liquid transition on solidification and wettability of Sn-0.7Cu-xBi solder
The electrical resistivity-temperature curve (ρ-T) of Sn-0.7Cu-xBi (wt.%) melts was measured, and anomalous changes were observed on the ρ-T curve at the temperature far above the corresponding liquidus. The results reveal that the melts have experienced a temperature-induced liquid-liquid transitio...
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Main Authors: | Li, X. F., Zhao, X. M., Zhang, F., Zu, F. Q., Zhou, Wei |
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Other Authors: | School of Mechanical and Aerospace Engineering |
Format: | Article |
Language: | English |
Published: |
2021
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/146880 |
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Institution: | Nanyang Technological University |
Language: | English |
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