Effect of liquid-liquid transition on solidification and wettability of Sn-0.7Cu-xBi solder

• المؤلفون الرئيسيون: Li, X. F., Zhao, X. M., Zhang, F., Zu, F. Q., Zhou, Wei
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2021
• الموضوعات: Engineering::Materials; Sn-0.7Cu-xBi Solders; Liquid-liquid Transition
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/146880

The electrical resistivity-temperature curve (ρ-T) of Sn-0.7Cu-xBi (wt.%) melts was measured, and anomalous changes were observed on the ρ-T curve at the temperature far above the corresponding liquidus. The results reveal that the melts have experienced a temperature-induced liquid-liquid transitio...