Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines

In today's cost driven semiconductor industry, utilizing the available capacity to its maximum limits is of prime importance for being competitive. With the equipments being expensive and the technology changing very fast, utilization of the available resources, by minimizing the repair time b...

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Main Authors: Sunil, Bhandari, Du, Xian, Wang, Xiaobo
Other Authors: Appa Iyer Sivakumar
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/15186
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-151862020-11-01T11:28:44Z Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines Sunil, Bhandari Du, Xian Wang, Xiaobo Appa Iyer Sivakumar School of Mechanical and Aerospace Engineering Singapore-MIT Alliance Programme DRNTU::Engineering In today's cost driven semiconductor industry, utilizing the available capacity to its maximum limits is of prime importance for being competitive. With the equipments being expensive and the technology changing very fast, utilization of the available resources, by minimizing the repair time brings to the forefront production capacity that would have otherwise stayed hidden or lost. The other key issue that any company needs to address is that repairing complicated machines (such as wire bond) requires training of personnel and this leads to extra costs. Thus a system was felt necessary that would incorporate the breakdown diagnosis, so as to reduce MTTR. The e- diagnostics system that has been developed as a part of this project aims at making a wholesome online diagnostic tool. This e-Diagnostics system also aims to centralize the database of all the wire bonding machines, thus easing the access of information and providing key information, that would otherwise require another tool such as data mining. This system would hence provide a long-term solution to the company, as it can be mdoified to serve machines other than Wire Bonding machines. ​Master of Science (IMST) 2009-04-09T07:54:01Z 2009-04-09T07:54:01Z 2002 2002 Thesis http://hdl.handle.net/10356/15186 en 84 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering
spellingShingle DRNTU::Engineering
Sunil, Bhandari
Du, Xian
Wang, Xiaobo
Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
description In today's cost driven semiconductor industry, utilizing the available capacity to its maximum limits is of prime importance for being competitive. With the equipments being expensive and the technology changing very fast, utilization of the available resources, by minimizing the repair time brings to the forefront production capacity that would have otherwise stayed hidden or lost. The other key issue that any company needs to address is that repairing complicated machines (such as wire bond) requires training of personnel and this leads to extra costs. Thus a system was felt necessary that would incorporate the breakdown diagnosis, so as to reduce MTTR. The e- diagnostics system that has been developed as a part of this project aims at making a wholesome online diagnostic tool. This e-Diagnostics system also aims to centralize the database of all the wire bonding machines, thus easing the access of information and providing key information, that would otherwise require another tool such as data mining. This system would hence provide a long-term solution to the company, as it can be mdoified to serve machines other than Wire Bonding machines.
author2 Appa Iyer Sivakumar
author_facet Appa Iyer Sivakumar
Sunil, Bhandari
Du, Xian
Wang, Xiaobo
format Theses and Dissertations
author Sunil, Bhandari
Du, Xian
Wang, Xiaobo
author_sort Sunil, Bhandari
title Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
title_short Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
title_full Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
title_fullStr Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
title_full_unstemmed Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
title_sort building an intelligent e-diagnostics system for reducing mean time to repair (mttr) of wire bond machines
publishDate 2009
url http://hdl.handle.net/10356/15186
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