Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
In today's cost driven semiconductor industry, utilizing the available capacity to its maximum limits is of prime importance for being competitive. With the equipments being expensive and the technology changing very fast, utilization of the available resources, by minimizing the repair time b...
Saved in:
Main Authors: | Sunil, Bhandari, Du, Xian, Wang, Xiaobo |
---|---|
Other Authors: | Appa Iyer Sivakumar |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/15186 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
by: Sunil, Bhandari, et al.
Published: (2014) -
Evaluation of MTTR variable as a key indicator of maintenance achievement to retain the network performance
by: , SUGIANTO, Johanes Purwo, et al.
Published: (2005) -
Development of high strength gold bonding wires for fine pitch wire bonding process
by: Dong, Albert Renjun
Published: (2008) -
Reliability of copper wire bonding
by: Ang, Joash Wei Qiang
Published: (2012) -
Characterisation of thermosonic applications in wire bonding
by: Moey, Chin Hui.
Published: (2008)