A new computational approach for three-dimensional singular stress analysis of interface voids

• Main Authors: Zhang, Yuxuan, Ping, Xuecheng, Wang, Congman, Xiao, Zhongmin, Yang, Jiyuan, Chen, Mengcheng
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2021
• Subjects: Engineering::Mechanical engineering; Intensity Factors; Bimaterial Interface
• Online Access: https://hdl.handle.net/10356/151864
• Institution: Nanyang Technological University

Defects in terms of three-dimensional voids are commonly encountered at bi-material interfaces. In the current study, the singular stress field near the circumferential corner line of a three-dimensional axisymmetric interfacial void is analyzed using our newly established singular interface edge el...