A new computational approach for three-dimensional singular stress analysis of interface voids
Defects in terms of three-dimensional voids are commonly encountered at bi-material interfaces. In the current study, the singular stress field near the circumferential corner line of a three-dimensional axisymmetric interfacial void is analyzed using our newly established singular interface edge el...
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Main Authors: | , , , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2021
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/151864 |
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Institution: | Nanyang Technological University |
Language: | English |