A new computational approach for three-dimensional singular stress analysis of interface voids

Defects in terms of three-dimensional voids are commonly encountered at bi-material interfaces. In the current study, the singular stress field near the circumferential corner line of a three-dimensional axisymmetric interfacial void is analyzed using our newly established singular interface edge el...

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Bibliographic Details
Main Authors: Zhang, Yuxuan, Ping, Xuecheng, Wang, Congman, Xiao, Zhongmin, Yang, Jiyuan, Chen, Mengcheng
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2021
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Online Access:https://hdl.handle.net/10356/151864
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Institution: Nanyang Technological University
Language: English

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