A new computational approach for three-dimensional singular stress analysis of interface voids

• المؤلفون الرئيسيون: Zhang, Yuxuan, Ping, Xuecheng, Wang, Congman, Xiao, Zhongmin, Yang, Jiyuan, Chen, Mengcheng
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2021
• الموضوعات: Engineering::Mechanical engineering; Intensity Factors; Bimaterial Interface
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/151864

Defects in terms of three-dimensional voids are commonly encountered at bi-material interfaces. In the current study, the singular stress field near the circumferential corner line of a three-dimensional axisymmetric interfacial void is analyzed using our newly established singular interface edge el...