A new computational approach for three-dimensional singular stress analysis of interface voids

• Main Authors: Zhang, Yuxuan, Ping, Xuecheng, Wang, Congman, Xiao, Zhongmin, Yang, Jiyuan, Chen, Mengcheng
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Article
• 語言: English
• 出版: 2021
• 主題: Engineering::Mechanical engineering; Intensity Factors; Bimaterial Interface
• 在線閱讀: https://hdl.handle.net/10356/151864

Defects in terms of three-dimensional voids are commonly encountered at bi-material interfaces. In the current study, the singular stress field near the circumferential corner line of a three-dimensional axisymmetric interfacial void is analyzed using our newly established singular interface edge el...