High-speed CMOS time-domain ADC design
Time-domain ADC (TD-ADC) has been emerging recently because of its compact area and energy efficiency for high-speed medium-resolution (8-10 bits) applications. However, the speed superiority of TD-ADC over the voltage-domain comparatives remains to be verified, as the published TD-ADC shows no a...
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sg-ntu-dr.10356-1683312023-07-08T05:40:28Z High-speed CMOS time-domain ADC design Chen, Qian Boon Chirn Chye School of Electrical and Electronic Engineering Centre for Integrated Circuits and Systems ECCBoon@ntu.edu.sg Engineering::Electrical and electronic engineering Time-domain ADC (TD-ADC) has been emerging recently because of its compact area and energy efficiency for high-speed medium-resolution (8-10 bits) applications. However, the speed superiority of TD-ADC over the voltage-domain comparatives remains to be verified, as the published TD-ADC shows no advantage over SARs in high-speed scenarios. In addition, the voltage scalability of TD-ADC indicated by its digital style has not been reported. To demonstrate the claiming potentials of TD-ADC in conversion speed and technology adaptability, we have conducted comprehensive research on high-speed TD-ADC design and proposed a single-channel voltage-scalable 8 GS/s 8-bit TD-ADC in 28 nm CMOS. The proposed TD-ADC breaks the speed limit of the traditional TD-ADC by leveraging asynchronous pipeline successive approximation (APSA), which reduces the quantization period to approximate one-stage comparator decision time. A co-design methodology of voltage-to-time converter (VTC) and time-to-digital converter (TDC) has been proposed to optimize the ADC linearity without increasing the complexity or power consumption, reducing the linearity request of VTC. The TD-ADC is fabricated in 28 nm CMOS and occupies an active area of 0.011 mm2, demonstrating 39.2 dB SNDR, 56.1 dB SFDR at 0.9 V 8 GS/s with 85.3 mW power dissipation and 37.6 dB SNDR, 56.3 dB SFDR at 0.7 V 5.05 GS/s with 23.1 mW power dissipation, achieving 143.1 fJ/conv.-step and 74.3 fJ/Conv.-step Nyquist FoMW, respectively. Furthermore, a low-voltage 4 GS/s standalone VTC has also been implemented, which supports the rail-to-rail input with the proposed shrink sampling. The VTC is designed and fabricated in 28 nm CMOS and occupies a 0.0012 mm2 active area. It achieves -56.4 dB THD at 4 GS/s with only a 0.6 V power supply. Doctor of Philosophy 2023-05-29T04:51:19Z 2023-05-29T04:51:19Z 2023 Thesis-Doctor of Philosophy Chen, Q. (2023). High-speed CMOS time-domain ADC design. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/168331 https://hdl.handle.net/10356/168331 10.32657/10356/168331 en A19d6a 0053 MOE2019-T2-1-114 This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License (CC BY-NC 4.0). application/pdf Nanyang Technological University |
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Engineering::Electrical and electronic engineering Chen, Qian High-speed CMOS time-domain ADC design |
description |
Time-domain ADC (TD-ADC) has been emerging recently because of its compact
area and energy efficiency for high-speed medium-resolution (8-10 bits) applications.
However, the speed superiority of TD-ADC over the voltage-domain
comparatives remains to be verified, as the published TD-ADC shows no advantage
over SARs in high-speed scenarios. In addition, the voltage scalability of
TD-ADC indicated by its digital style has not been reported. To demonstrate
the claiming potentials of TD-ADC in conversion speed and technology adaptability,
we have conducted comprehensive research on high-speed TD-ADC design
and proposed a single-channel voltage-scalable 8 GS/s 8-bit TD-ADC in 28 nm
CMOS. The proposed TD-ADC breaks the speed limit of the traditional TD-ADC
by leveraging asynchronous pipeline successive approximation (APSA), which reduces
the quantization period to approximate one-stage comparator decision time.
A co-design methodology of voltage-to-time converter (VTC) and time-to-digital
converter (TDC) has been proposed to optimize the ADC linearity without increasing
the complexity or power consumption, reducing the linearity request of VTC.
The TD-ADC is fabricated in 28 nm CMOS and occupies an active area of 0.011
mm2, demonstrating 39.2 dB SNDR, 56.1 dB SFDR at 0.9 V 8 GS/s with 85.3
mW power dissipation and 37.6 dB SNDR, 56.3 dB SFDR at 0.7 V 5.05 GS/s with
23.1 mW power dissipation, achieving 143.1 fJ/conv.-step and 74.3 fJ/Conv.-step
Nyquist FoMW, respectively. Furthermore, a low-voltage 4 GS/s standalone VTC
has also been implemented, which supports the rail-to-rail input with the proposed
shrink sampling. The VTC is designed and fabricated in 28 nm CMOS and occupies
a 0.0012 mm2 active area. It achieves -56.4 dB THD at 4 GS/s with only a
0.6 V power supply. |
author2 |
Boon Chirn Chye |
author_facet |
Boon Chirn Chye Chen, Qian |
format |
Thesis-Doctor of Philosophy |
author |
Chen, Qian |
author_sort |
Chen, Qian |
title |
High-speed CMOS time-domain ADC design |
title_short |
High-speed CMOS time-domain ADC design |
title_full |
High-speed CMOS time-domain ADC design |
title_fullStr |
High-speed CMOS time-domain ADC design |
title_full_unstemmed |
High-speed CMOS time-domain ADC design |
title_sort |
high-speed cmos time-domain adc design |
publisher |
Nanyang Technological University |
publishDate |
2023 |
url |
https://hdl.handle.net/10356/168331 |
_version_ |
1772825673834954752 |